Electroless Nickel/Palldium Immersion Gold for PCB Final Finishing - RoHS compliance
| 1 | SSC AFB-78 | Alkaline Cleaner for Flexible boards |
| 2 | SSC PD-120 | Pd initiator |
| 3 | SSC LTEN-287 | Low temperature EN for ENIG |
| 4 | SSC EN-28 | EN for ENIG |
| 5 | SSC EPD-01 | Electroless Palladium for ENEPIG |
| 6 | SSC ImAu-08 | Immersion Au for ENIG |
Organic Solderability Preservative for PCB Final Finishing
| 7 | SSC CP-10 | Dry salt for OSP acid cleaner |
| 8 | SSC CP-20 | Microetch for copper and copper alloys |
| 9 | SSC CPCOAT CU-37 | OSP Accelerator |
| 10 | SSC CPCOAT | OSP for selective PCB boards |
| 11 | SSC CPCOAT PLUS | OSP for high temperature application |
Pore Blocker for Electronics Applications
| 12 | SSC GPCOAT-02 | Pore Blocker for Au/Ag protection (Connector, ENIG, Jewellery etc) |
| 13 | SSC CU I | Copper Protection, Pink Gold |
| 14 | SSC AU-SK | Post Treatment of Gold, Nickel, Electroless Nickel and Tin/Tin Alloy |
| 15 | SSC ANTI-08 | Pore Blocker for Leadframe, Smartcard and Touch Screen Panel |
| 16 | SSC AU PB-01 | Pore Blocker for thin gold/silver plating layers |
Electroplating Chemicals for Connectors & Leadframe
| 17 | SSC ES-05 | Electrolytic Cleaner |
| 18 | SSC ES-06 | Electrolytic and Soak Cleaner |
| 19 | SSC HGC-01 | Hard gold plating |
| 20 | SSC HSAG | High Speed Silver |
| 21 | SSC HAG | Hard silver plating |
| 22 | SSC PDNI-AF | Ammonia Odor Free Palladium/Nickel Plating |
| 23 | SSC SP815 | Ni-P alloy electroplating |
Special Chemicals for 3-D MID Process
| 24 | SSC MID-NM | Alkaline Etching for LCP, Resin and LDS |
| 25 | SSC PREDIP | Enhancer for adhesion |
| 26 | SSC MID-PD | Pd Activator |
| 27 | SSC MID-ECU | Electroless CU |
| 28 | SSC MID-LTEN | Electroless NI |
| 29 | SSC MID-WD | EN Protection |
Electroless Nickel Process Chemicals - RoHS Compliant
| 30 | SSC AC-01 | Soak cleaner |
| 31 | SSC EC-02 | Electrocleaner |
| 32 | SSC AE-2A | Acid Etching for Aluminium and Alloys |
| 33 | SSC DS-98 | Aluminium desmutting |
| 34 | SSC AL-DS | Aluminium desmutting and activation |
| 35 | SSC ZC-69 | Zincate |
| 36 | SSC NI-08AM | M-P EN for Al & Alloys |
| 37 | SSC NI-08FM | M-P EN for Fe & Cu |
| 38 | SSC NI-68 | H-P EN |
| 39 | SSC WD-01 | EN Chrome Free Passivation |
| 40 | SSC EN WT | EN Waste Treatment |
Non-metallic Surface Metallization Process (POP)
| 41 | SSC WT-68 | Etching Wetting Agent |
| 42 | SSC NE-02 | Neutralizer |
| 43 | SSC ACC-38 | Promoter |
| 44 | SSC CAT-34 | Pd Activator |
| 45 | SSC AEN-19 | Alkaline Electroless Nickel for Plastic |
| 46 | SSC ACU-01S | Acid Aluvial Copper |
| 47 | SSC ACU-07 | Acid Copper |
| 48 | SSC NI-SB100 | Semi bright nickel |
| 49 | SSC NI-B200 | Bright nickel |
| 50 | SSC NI 700 | Micro porous nickel |
| 51 | SSC CR ACT | Electrolytic (cathodic) activator for electroplated bright nickel deposits plated prior to bright chromium plating |
| 52 | SSC CR 800 | Bright chrome |
| 53 | SSC WD-01 | Post treatment |
General Chemicals
| 54 | SSC BS | Bright Silver Plating |
| 55 | SSC NCG-01 | Non Cyanide Gold |
| 56 | SSC EP-02 | Electrolytic Stainless Steel Polishing |
| 57 | SSC CP-1 | Copper Polishing |
| 58 | SSC ACV 35 | Dry Salt Activator |
| 59 | SSC BNZ | Black Nickel plating |
| 60 | SSC BNT | Tin-Nickel alloy plating |
| 61 | SSC NSTRIP-01 | Non Cyanide Nickel and EN Stripper from Steel and Copper |
| 62 | SSC NSTRIP-06 | Non Cyanide Nickel Stripper from Copper and Copper Alloys |
| 63 | SSC SNTRIP-01 | Electrolytic Tin Stripper from Stainless Steel Jigs |
| 64 | SSC SNTRIP-08 | Nitric acid free Stripper for Tin and solder |
| 65 | SSC CUTRIP-01 | Copper Stripper from Stainless Steel |
| 66 | SSC NES-P | Electrolytic Jig Stripper |